? semiconductor components industries, llc, 2015 april, 2015 ? rev. 0 1 publication order number: nsd350h/d nsd350h high voltage switching diode the nsd350h is a high voltage switching diode in a sod?323 surface mount package. features ? small footprint package, sod?323 ? nsv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? pb?free device, halogen free/bfr free and are rohs compliant typical applications ? flat panel tvs ? power supply ? industrial ? wireless handsets ? automotive modules maximum ratings single diode (t a = 25 c) rating symbol max unit reverse voltage v r 350 v forward current (dc) i f 200 ma non?repetitive peak forward current (square wave, t j = 25 c prior to surge) t = 10 s t = 100 s t = 1 ms t = 10 ms i fsm 12 5 2 1.5 a thermal characteristics characteristic symbol max unit total device dissipation t a = 25 c derate above 25 c p d (note 1) 250 2 mw mw/ c thermal resistance, junction to ambient r ja (note 1) 500 c/w junction and storage temperature range t j , t stg ?55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr?4 100 mm 2 2 oz cu pcb www. onsemi.com marking diagram sod?323 case 477 style 1 device package shipping ? ordering information nsd350ht1g sod?323 (pb?free) 3000 / tape & reel aj = specific device code m = date code = pb?free package aj m (note: microdot may be in either location) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. NSVD350HT1G 1 cathode 2 anode
nsd350h www. onsemi.com 2 table 1. electrical characteristics (t a = 25 c) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 a) v (br)r 350 v reverse leakage (v r = 300 v) i r 150 na reverse leakage (v r = 350 v) i r 5 a forward voltage (i f = 100 ma) v f 1.1 v total capacitance (v r = 0 v, f = 1.0 mhz) c t 5.0 pf reverse recovery time (i f = i r = 10 ma, i r (rec) = 1.0 ma, figure 1) t rr 55 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2 k 820 0.1 f dut v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1 ma) i f input signal figure 1. recovery time equivalent test circuit
nsd350h www. onsemi.com 3 typical characteristics figure 2. reverse leakage current figure 3. forward voltage v r , reverse voltage (v) v f , forward voltage (v) 300 250 200 350 150 100 50 0 1e?11 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 1 10 100 figure 4. total capacitance v r , reverse voltage (v) 30 25 20 15 10 5 0 0 0.2 0.6 0.8 1.2 1.4 1.8 2.0 i r , leakage current (a) i f , forward current (ma) c t , total capacitance (pf) 1e?10 1e?09 1e?08 1e?07 1e?06 1e?05 1e?04 0.4 1.0 1.6 t j = 25 c f = 1 mhz 1.0 1.1 150 c 125 c ?55 c 25 c 85 c 150 c 125 c ?55 c 25 c 85 c
nsd350h www. onsemi.com 4 package dimensions sod?323 case 477?02 issue h h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 1: pin 1. cathode (polarity band) 2. anode on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nsd350h/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
|
